NF-CMP-300

Product Description:

Meet all complex planarization process requirements in 12 inch wafer manufacturing. Suitable for 5nm/7nm/14nm and other logic process and memory process, covering STI/ILD/IMD, FinFET/Metal gate/W/Cu and other processes.

Product features:

1. New and efficient structural design

2. Advanced endpoint detection technology

3. high process flexibility

4. Corresponding grinding head and grinding table to ensure better process consistency

5. The output rate is significantly higher than that of international imported equipment