NF-CMP-200

Product Description:

It is mainly used for 8 inch wafer all flattening process requirements in wafer chip manufacturing, such as IMD, STI, ILD, BPSG, Contactor, metal line, etc., and also supports flattening process in TSV, MEMS and other new fields.

Product features:

1.  the machine structure is compact, saving the space of the purification plant;

2. can realize the wafer "dry in dry out";

3. high reliability

4.  online endpoint detection method, real-time process control system;

5. The control software is completely autonomous and controllable.